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Proposed for presentation at the AVS 67th International Symposium & Exhibition held October 25-29, 2021 in ,最新文献

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Copper Electrodeposition in Through Sillicon Vias: Scaling from Die Level to Wafer Level Plating. 铜在硅通孔中的电沉积:从模级到晶圆级电镀的缩放。
Proposed for presentation at the AVS 67th International Symposium & Exhibition held October 25-29, 2021 in , Pub Date : 2021-10-01 DOI: 10.2172/1891753
J. McDow, R. Schmitt, M. Hirabayashi, E. Baca, L. Menk, A. Hollowell, M. Jordan
{"title":"Copper Electrodeposition in Through Sillicon Vias: Scaling from Die Level to Wafer Level Plating.","authors":"J. McDow, R. Schmitt, M. Hirabayashi, E. Baca, L. Menk, A. Hollowell, M. Jordan","doi":"10.2172/1891753","DOIUrl":"https://doi.org/10.2172/1891753","url":null,"abstract":"","PeriodicalId":448803,"journal":{"name":"Proposed for presentation at the AVS 67th International Symposium & Exhibition held October 25-29, 2021 in ,","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121526904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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