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Modeling and Application of Flexible Electronics Packaging最新文献

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Single-needle Peeling 单针剥
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_5
Yongan Huang, Z. Yin, X. Wan
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引用次数: 0
Multi-needle Peeling 多剥
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_6
Yongan Huang, Z. Yin, X. Wan
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引用次数: 0
Interfacial Modeling of Flexible Multilayer Structures 柔性多层结构的界面建模
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_2
Yongan Huang, Z. Yin, X. Wan
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引用次数: 0
Tension-Assisted Peeling Tension-Assisted剥
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_4
Yongan Huang, Z. Yin, X. Wan
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引用次数: 0
Measurement of Fracture Strength of Ultra-thin Silicon Chip and Adhesive Fracture Energy 超薄硅片断裂强度及粘接断裂能的测定
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_3
Yongan Huang, Z. Yin, X. Wan
{"title":"Measurement of Fracture Strength of Ultra-thin Silicon Chip and Adhesive Fracture Energy","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_3","DOIUrl":"https://doi.org/10.1007/978-981-13-3627-0_3","url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129211843","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advanced Electronic Packaging 先进电子封装
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_1
Yongan Huang, Z. Yin, X. Wan
{"title":"Advanced Electronic Packaging","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_1","DOIUrl":"https://doi.org/10.1007/978-981-13-3627-0_1","url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114980736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Conformal Peeling 保形剥
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_7
Yongan Huang, Z. Yin, X. Wan
{"title":"Conformal Peeling","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_7","DOIUrl":"https://doi.org/10.1007/978-981-13-3627-0_7","url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128343459","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Laser Lift-off 激光发射
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_8
Yongan Huang, Z. Yin, X. Wan
{"title":"Laser Lift-off","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_8","DOIUrl":"https://doi.org/10.1007/978-981-13-3627-0_8","url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"140 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131509656","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Vacuum-Based Picking-up and Placing-on 基于真空的拾取和放置
Modeling and Application of Flexible Electronics Packaging Pub Date : 1900-01-01 DOI: 10.1007/978-981-13-3627-0_9
Yongan Huang, Z. Yin, X. Wan
{"title":"Vacuum-Based Picking-up and Placing-on","authors":"Yongan Huang, Z. Yin, X. Wan","doi":"10.1007/978-981-13-3627-0_9","DOIUrl":"https://doi.org/10.1007/978-981-13-3627-0_9","url":null,"abstract":"","PeriodicalId":440602,"journal":{"name":"Modeling and Application of Flexible Electronics Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129454609","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
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