The International journal of microcircuits and electronic packaging最新文献

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Embedding a Passive Material Layer in Low Temperature Co‐Fired Packing 在低温共烧填料中嵌入钝化材料层

The International journal of microcircuits and electronic packaging Pub Date : 2012-04-03 DOI: 10.1002/9781118371107.CH28

E. Twiname, C. Randall, G. Messing

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引用次数: 2

Microstructural modeling and electronic interconnect reliability 微结构建模和电子互连可靠性

The International journal of microcircuits and electronic packaging Pub Date : 1997-12-01 DOI: 10.1108/09540919710777536

P. Winter, E. Wallach

引用次数: 8