3D Integration for NoC-based SoC Architectures最新文献

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Influence of Stacked 3D Memory/Cache Architectures on GPUs 堆叠3D内存/缓存架构对gpu的影响
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_11
Ahmed Al-Maashri, Guangyu Sun, Xiangyu Dong, Yuan Xie, N. Vijaykrishnan
{"title":"Influence of Stacked 3D Memory/Cache Architectures on GPUs","authors":"Ahmed Al-Maashri, Guangyu Sun, Xiangyu Dong, Yuan Xie, N. Vijaykrishnan","doi":"10.1007/978-1-4419-7618-5_11","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_11","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124468767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and Computer Aided Design of 3DIC 3DIC设计与计算机辅助设计
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_4
P. Franzon, W. R. Davis, T. Thorolfsson
{"title":"Design and Computer Aided Design of 3DIC","authors":"P. Franzon, W. R. Davis, T. Thorolfsson","doi":"10.1007/978-1-4419-7618-5_4","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_4","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127598804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Three-Dimensional Networks-on-Chip: Performance Evaluation 三维片上网络:性能评估
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_6
B. Feero, P. Pande
{"title":"Three-Dimensional Networks-on-Chip: Performance Evaluation","authors":"B. Feero, P. Pande","doi":"10.1007/978-1-4419-7618-5_6","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_6","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115530477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
3-D NoC on Inductive Wireless Interconnect 感应无线互连的三维NoC
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_10
Hiroki Matsutani, M. Koibuchi, T. Kuroda, H. Amano
{"title":"3-D NoC on Inductive Wireless Interconnect","authors":"Hiroki Matsutani, M. Koibuchi, T. Kuroda, H. Amano","doi":"10.1007/978-1-4419-7618-5_10","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_10","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"178 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121143959","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Asynchronous 3D-NoCs Making Use of Serialized Vertical Links 异步3d - noc利用序列化垂直链接
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_7
Abbas Sheibanyrad, F. Pétrot
{"title":"Asynchronous 3D-NoCs Making Use of Serialized Vertical Links","authors":"Abbas Sheibanyrad, F. Pétrot","doi":"10.1007/978-1-4419-7618-5_7","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_7","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"61 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121101171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Physical Analysis of NoC Topologies for 3-D Integrated Systems 三维集成系统NoC拓扑的物理分析
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_5
V. Pavlidis, E. Friedman
{"title":"Physical Analysis of NoC Topologies for 3-D Integrated Systems","authors":"V. Pavlidis, E. Friedman","doi":"10.1007/978-1-4419-7618-5_5","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_5","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129374726","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Testing 3D Stacked ICs Containing Through-Silicon Vias 测试含硅通孔的3D堆叠集成电路
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_3
E. Marinissen
{"title":"Testing 3D Stacked ICs Containing Through-Silicon Vias","authors":"E. Marinissen","doi":"10.1007/978-1-4419-7618-5_3","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_3","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"832 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123926346","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks 芯片上的三维网络拓扑综合:为芯片堆栈设计自定义拓扑
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_9
Ciprian Seiculescu, S. Murali, L. Benini, G. Micheli
{"title":"3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks","authors":"Ciprian Seiculescu, S. Murali, L. Benini, G. Micheli","doi":"10.1007/978-1-4419-7618-5_9","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_9","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125110290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Three-Dimensional Integration of Integrated Circuits - an Introduction 集成电路三维集成导论
3D Integration for NoC-based SoC Architectures Pub Date : 1900-01-01 DOI: 10.1007/978-1-4419-7618-5_1
C. S. Tan
{"title":"Three-Dimensional Integration of Integrated Circuits - an Introduction","authors":"C. S. Tan","doi":"10.1007/978-1-4419-7618-5_1","DOIUrl":"https://doi.org/10.1007/978-1-4419-7618-5_1","url":null,"abstract":"","PeriodicalId":406583,"journal":{"name":"3D Integration for NoC-based SoC Architectures","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134455242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
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