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Integrated Circuit Fabrication最新文献

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Lithography 光刻技术
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-4
Kumar Shubham, Ankaj Gupta
{"title":"Lithography","authors":"Kumar Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-4","DOIUrl":"https://doi.org/10.1201/9781003178583-4","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123261302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Etching 蚀刻
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1002/9781119990413.ch11
K. Shubham, Ankaj Gupta
{"title":"Etching","authors":"K. Shubham, Ankaj Gupta","doi":"10.1002/9781119990413.ch11","DOIUrl":"https://doi.org/10.1002/9781119990413.ch11","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"122 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115607689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
VLSI Process Integration VLSI制程集成
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-10
K. Shubham, Ankaj Gupta
{"title":"VLSI Process Integration","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-10","DOIUrl":"https://doi.org/10.1201/9781003178583-10","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133647671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Epitaxy
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/b19367-5
K. Shubham, Ankaj Gupta
{"title":"Epitaxy","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/b19367-5","DOIUrl":"https://doi.org/10.1201/b19367-5","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116072600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Oxidation 氧化
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-3
K. Shubham, Ankaj Gupta
{"title":"Oxidation","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-3","DOIUrl":"https://doi.org/10.1201/9781003178583-3","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124033020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Diffusion 扩散
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-6
K. Shubham, Ankaj Gupta
{"title":"Diffusion","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-6","DOIUrl":"https://doi.org/10.1201/9781003178583-6","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"108 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122543379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Packaging 包装
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-9
K. Shubham, Ankaj Gupta
{"title":"Packaging","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-9","DOIUrl":"https://doi.org/10.1201/9781003178583-9","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125705247","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Film Deposition: Dielectric, Polysilicon and Metallization 薄膜沉积:介电、多晶硅和金属化
Integrated Circuit Fabrication Pub Date : 2021-02-17 DOI: 10.1201/9781003178583-8
K. Shubham, Ankaj Gupta
{"title":"Film Deposition: Dielectric, Polysilicon and Metallization","authors":"K. Shubham, Ankaj Gupta","doi":"10.1201/9781003178583-8","DOIUrl":"https://doi.org/10.1201/9781003178583-8","url":null,"abstract":"","PeriodicalId":402677,"journal":{"name":"Integrated Circuit Fabrication","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-02-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124195018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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