Cost Engineering in Printed Circuit Board Manufacturing最新文献

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Cost Presentation 成本报告
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-6
R. Hedden
{"title":"Cost Presentation","authors":"R. Hedden","doi":"10.4324/9781003065609-6","DOIUrl":"https://doi.org/10.4324/9781003065609-6","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117108630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis 分析
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.1142/9781786345738_0003
R. Hedden
{"title":"Analysis","authors":"R. Hedden","doi":"10.1142/9781786345738_0003","DOIUrl":"https://doi.org/10.1142/9781786345738_0003","url":null,"abstract":"—A new method based on the Cavalieri condition for the Radon transform is developed to solve a problem of ROI tomography. This condition is used to construct a system of linear algebraic equations to estimate unknown projection data. Computational experiment has shown that the proposed method significantly improves the reconstruction accuracy, weakens artifacts, and provides an estimate of the internal structure of the object outside the region of interest","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125781190","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Printed Circuit Board Terminology 印刷电路板术语
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-2
R. Hedden
{"title":"Printed Circuit Board Terminology","authors":"R. Hedden","doi":"10.4324/9781003065609-2","DOIUrl":"https://doi.org/10.4324/9781003065609-2","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122497733","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimating Algorithms 估计算法
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-4
R. Hedden
{"title":"Estimating Algorithms","authors":"R. Hedden","doi":"10.4324/9781003065609-4","DOIUrl":"https://doi.org/10.4324/9781003065609-4","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124153600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimating Methodology 估算方法
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-3
R. Hedden
{"title":"Estimating Methodology","authors":"R. Hedden","doi":"10.4324/9781003065609-3","DOIUrl":"https://doi.org/10.4324/9781003065609-3","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129585563","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Burden Rate Composition and Cost Structure 负担率、构成和成本结构
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-8
R. Hedden
{"title":"Burden Rate Composition and Cost Structure","authors":"R. Hedden","doi":"10.4324/9781003065609-8","DOIUrl":"https://doi.org/10.4324/9781003065609-8","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127981615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimating Terminology 估计术语
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-1
R. Hedden
{"title":"Estimating Terminology","authors":"R. Hedden","doi":"10.4324/9781003065609-1","DOIUrl":"https://doi.org/10.4324/9781003065609-1","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"283 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132843750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimating Engineering and Other Expenses 估算工程和其他费用
Cost Engineering in Printed Circuit Board Manufacturing Pub Date : 2020-08-03 DOI: 10.4324/9781003065609-7
R. Hedden
{"title":"Estimating Engineering and Other Expenses","authors":"R. Hedden","doi":"10.4324/9781003065609-7","DOIUrl":"https://doi.org/10.4324/9781003065609-7","url":null,"abstract":"","PeriodicalId":332881,"journal":{"name":"Cost Engineering in Printed Circuit Board Manufacturing","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125344031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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