{"title":"Ceramic Substrates","authors":"Fred W. Kear","doi":"10.1201/9781003066668-3","DOIUrl":"https://doi.org/10.1201/9781003066668-3","url":null,"abstract":"","PeriodicalId":260114,"journal":{"name":"Hybrid Assemblies and Multichip Modules","volume":"100 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115743759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Testing Methods","authors":"Fred W. Kear","doi":"10.1201/9781003066668-9","DOIUrl":"https://doi.org/10.1201/9781003066668-9","url":null,"abstract":"","PeriodicalId":260114,"journal":{"name":"Hybrid Assemblies and Multichip Modules","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125747809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Multichip Modules","authors":"Fred W. Kear","doi":"10.1201/9781003066668-13","DOIUrl":"https://doi.org/10.1201/9781003066668-13","url":null,"abstract":"","PeriodicalId":260114,"journal":{"name":"Hybrid Assemblies and Multichip Modules","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121847543","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Surface-Mount Components","authors":"Fred W. Kear","doi":"10.1201/9781003066668-6","DOIUrl":"https://doi.org/10.1201/9781003066668-6","url":null,"abstract":"","PeriodicalId":260114,"journal":{"name":"Hybrid Assemblies and Multichip Modules","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128710940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Interconnection Technologies","authors":"Fred W. Kear","doi":"10.1201/9781003066668-7","DOIUrl":"https://doi.org/10.1201/9781003066668-7","url":null,"abstract":"","PeriodicalId":260114,"journal":{"name":"Hybrid Assemblies and Multichip Modules","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133407761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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