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High Density Microbump Development for Multi-Project Wafer (MPW) Die. 多项目晶圆(MPW)模具高密度微凸点开发。
Proposed for presentation at the InterPACK held October 27-29, 2020 in Anaheim, CA. Pub Date : 2020-10-01 DOI: 10.2172/1830984
M. Jordan, A. Hollowell, J. Gutierrez, J. Mcclain, Christopher Nordquist, Christopher Michael, Michael Wood, Andrew Young
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