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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation最新文献

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation 集成低衬底温度与可扩展器件架构创新的新前景
New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation Pub Date : 2016-02-19 DOI: 10.2200/S00696ED1V01Y201601EET004
N. Ashraf, Shawon Alam, Mohaiminul Alam
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引用次数: 3
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