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Optical System Alignment, Tolerancing, and Verification XIV最新文献

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Exploiting wafer level packaging of VCSELs on silicon photonic integrated circuits (PICs) with the advantages of a novel, flip-chip bonding, active dry-alignments method on SOI up-reflecting mirrors (Conference Presentation) 利用一种新颖的倒装芯片键合、SOI上反射镜有源干对准方法的优势，在硅光子集成电路(PICs)上开发vcsel的晶圆级封装(会议报告)
Optical System Alignment, Tolerancing, and Verification XIV Pub Date : 2022-10-11 DOI: 10.1117/12.2633800
G. Delrosso
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引用次数: 0
Front Matter: Volume 12222 封面:第12222卷
Optical System Alignment, Tolerancing, and Verification XIV Pub Date : 2022-10-06 DOI: 10.1117/12.2661434
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引用次数: 0
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