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Encapsulation Technologies for Electronic Applications最新文献

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Trends and challenges 趋势与挑战
Encapsulation Technologies for Electronic Applications Pub Date : 2019-03-18 DOI: 10.1016/b978-0-12-811978-5.00010-9
H. Ardebili, Jiawei Zhang, M. Pecht
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引用次数: 0
Copyright 版权
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/b978-0-12-811978-5.09996-x
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引用次数: 0
Injection molding 注塑
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/b978-0-12-811978-5.00004-3
H. Ardebili, Jiawei Zhang, M. Pecht
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引用次数: 76
Encapsulation process technology 封装工艺技术
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/B978-0-12-811978-5.00003-1
K. Fang
{"title":"Encapsulation process technology","authors":"K. Fang","doi":"10.1016/B978-0-12-811978-5.00003-1","DOIUrl":"https://doi.org/10.1016/B978-0-12-811978-5.00003-1","url":null,"abstract":"","PeriodicalId":197402,"journal":{"name":"Encapsulation Technologies for Electronic Applications","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129992693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Compression encapsulation 压缩封装
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/b978-0-12-811978-5.00005-5
H. Ardebili, Jiawei Zhang, M. Pecht
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引用次数: 0
Qualification and quality assurance 资格和质量保证
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/B978-0-8155-1576-0.50011-5
H. Ardebili, M. Pecht
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引用次数: 0
Plastic encapsulant materials 塑料封装材料
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/B978-0-8155-1576-0.50006-1
H. Ardebili, M. Pecht
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引用次数: 9
Characterization of encapsulant properties 封装剂性能表征
Encapsulation Technologies for Electronic Applications Pub Date : 1900-01-01 DOI: 10.1016/B978-0-8155-1576-0.50008-5
H. Ardebili, M. Pecht
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引用次数: 9
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