Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)

CVD TaN barrier for copper metallization and DRAM bottom electrode

Pub Date : 1999-05-26 DOI: 10.1109/IITC.1999.787096 A. Paranjpe, R. Bubber, L. Velo, G. Shang, S. Gopinath, J. Dalton, M. Moslehi

Interconnect performance modeling for 3D integrated circuits with multiple Si layers

Pub Date : 1999-05-26 DOI: 10.1109/IITC.1999.787067 S. Souri, K. C. Saraswat

Highly <111> textured Cu film formation on CVD-TiN film by Ti underlayer and Ar sputter etch for damascene interconnection

Pub Date : 1999-05-26 DOI: 10.1109/IITC.1999.787095 M. Sekiguchi, H. Sato, T. Harada, R. Etoh