集成MEMS的多物理场仿真技术

H. Toshiyoshi, T. Konishi, K. Machida, K. Masu
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引用次数: 13

摘要

我们在基于香料的电路模拟器(LTspice)上开发了微机电系统(MEMS)的多物理场仿真平台,并通过使用行为电流/电压源解释静电平行板致动器、粘弹性弹簧和机械锚等机电元件的分析模型。利用LTspice数学库中的积分函数,编制了机械运动方程的核求解程序。将仿真能力扩展到与CMOS移电平电路集成的静电数字扭转镜器件,并对其进行了测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A multi-physics simulation technique for integrated MEMS
We have developed a multi-physics simulation platform for microelectromechanical systems (MEMS) on a spice-based circuit simulator (LTspice) and by interpreting the analytical models for electromechanical components such as electrostatic parallel-plate actuator, viscoelastic spring, and mechanical anchor by using behavioral current/voltage sources. The Kernel solver for the mechanical equation of motion (EOM) has been programmed by simply using the integral function of the LTspice mathematic library. Simulation capability has been extended to and tested against the electrostatic digital torsion mirror device integrated with CMOS level shifter circuit.
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