SnAgCu焊点塑性损伤力学本构模型研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607158

Xiaoyan Li, Yongchang Yan, Na Liu

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引用次数: 2

摘要

采用基于热力学的损伤力学速率相关本构模型，对薄层共晶SnAgCu(SAC)焊点进行了实验模拟。非损伤本构通过体拉伸试验测量。真实应力与应变的关系为σ =85.26epsiv0.3536。基于Lemaitre延性损伤理论建立了损伤演化方程，并采用卸载弹性模量法测量了方程中的常数。损伤演化方程为D=1.0689epsivP-0.0008。采用损伤力学速率无关本构的铜棒间焊点剪切试验模拟(软件Ansys 9.0)与实际试验结果一致。

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Study of plasticity damage mechanics constitutive model for SnAgCu solder joint

A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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