{"title":"大功率器件封装用Cu-Ag微纳复合浆料的简易制备","authors":"Jiaxin Liu, Yun Mou, Yang Peng, Mingxiang Chen","doi":"10.1109/ECTC32862.2020.00124","DOIUrl":null,"url":null,"abstract":"In this paper, a novel Cu-Ag micro-nano composite particle (MNCP) paste was prepared, and a low temperature Cu- Cu bonding with high sheer strength was obtained. The microstructures and morphologies of the Cu-Ag MNCPs were systematically investigated. The surface chemical compositions of the composite particles displayed a little oxidized phenomenon, which could be reduced during sintering and bonding. After sintering at 275°C for 30 min under a low pressure, a sheer strength Cu-Cu bonding joint of 32.7 MPa was achieved. The fracture and cross-sectional microstructures of bonded joints exhibited obvious ductile characteristics and compact structure. These results manifested the Cu-Ag MNCPs are promising materials to fulfill the requirements of die-attach materials for high power device packaging.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"28 1","pages":"755-761"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Facile Preparation of Cu-Ag Micro-Nano Composite Paste for High Power Device Packaging\",\"authors\":\"Jiaxin Liu, Yun Mou, Yang Peng, Mingxiang Chen\",\"doi\":\"10.1109/ECTC32862.2020.00124\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a novel Cu-Ag micro-nano composite particle (MNCP) paste was prepared, and a low temperature Cu- Cu bonding with high sheer strength was obtained. The microstructures and morphologies of the Cu-Ag MNCPs were systematically investigated. The surface chemical compositions of the composite particles displayed a little oxidized phenomenon, which could be reduced during sintering and bonding. After sintering at 275°C for 30 min under a low pressure, a sheer strength Cu-Cu bonding joint of 32.7 MPa was achieved. The fracture and cross-sectional microstructures of bonded joints exhibited obvious ductile characteristics and compact structure. These results manifested the Cu-Ag MNCPs are promising materials to fulfill the requirements of die-attach materials for high power device packaging.\",\"PeriodicalId\":6722,\"journal\":{\"name\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"28 1\",\"pages\":\"755-761\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32862.2020.00124\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32862.2020.00124","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Facile Preparation of Cu-Ag Micro-Nano Composite Paste for High Power Device Packaging
In this paper, a novel Cu-Ag micro-nano composite particle (MNCP) paste was prepared, and a low temperature Cu- Cu bonding with high sheer strength was obtained. The microstructures and morphologies of the Cu-Ag MNCPs were systematically investigated. The surface chemical compositions of the composite particles displayed a little oxidized phenomenon, which could be reduced during sintering and bonding. After sintering at 275°C for 30 min under a low pressure, a sheer strength Cu-Cu bonding joint of 32.7 MPa was achieved. The fracture and cross-sectional microstructures of bonded joints exhibited obvious ductile characteristics and compact structure. These results manifested the Cu-Ag MNCPs are promising materials to fulfill the requirements of die-attach materials for high power device packaging.
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