CMOS和互连可靠性偏置温度不稳定性和接口陷阱

B. Kaczer, Ming-Fu Li
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引用次数: 0

摘要

本次会议包括六篇论文,描述了对偏温不稳定性和界面陷阱的理解和表征的最新进展。第一篇论文由D. Varghese(印度理工学院孟买分校)撰写,展示了时间延迟在NBTI测量中的重要性。作者认为,短时降解和长时间降解分别具有弥散性和阿累尼乌斯样。第二篇论文由A. T. Krishnan (Texas Instruments)撰写,讨论了氢扩散的材料依赖性及其对NBTI降解的影响。研究了不同频率下测量时延的影响和NBTI退化的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CMOS and interconnect reliability bias-temperature instability and interface traps
This Session includes six papers describing recent advances in the understanding and characterization of Bias-Temperature Instability and Interface Traps. The first paper, by D. Varghese (IIT Bombay), shows the importance of time delay in NBTI measurements. The authors argue that short time and long time degradation are respectively dispersive and Arrhenius-like. The second paper, by A. T. Krishnan (Texas Instruments), discusses the material dependence of hydrogen diffusion and its impact on NBTI degradation. The effect of the measurement delay and the role of NBTI degradation at different frequencies are also studied.
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