集成薄膜工艺和封装技术的高散热发光二极管

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117153

Y. Tsai, C. Hsu, K. F. Lin, Y. Chang, H. Hu, T. Chen, C. Chu, M. Chu

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引用次数: 0

摘要

我们报道了一种全新的技术，将薄膜制造工艺和封装技术结合在一起，形成LED结构的最短散热路径。该LED的有效热阻为3.54K/W，大大优于传统LED的10.8K/W，工作电流可从原来的230mA驱动到800mA。这些结果表明，基于我们的工作的LED结构有助于通过实现良好的散热来提高性能，并且比传统结构具有更高的应用潜力。

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High thermal dissipation of light emitting diodes by integrating thin film process and packaging technology

We report a brand new technique which is merged thin film fabrication process and packaging technology together to form the shortest thermal dissipation path of LED structure. The effective thermal resistance of the proposed LED was 3.54K/W, which is much better than that of the conventional one 10.8K/W and the operating current can be driven from original 230mA up to 800mA. These results indicate that the LED structure based on our work is useful in improving the performance by enabling great heat dissipation and have higher application potential than conventional one.

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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