K. Nemoto, S. Ikeda, O. Yoshida, J. Sasabe, Hua Su
{"title":"一种在生产初期减少系统缺陷的统计方法","authors":"K. Nemoto, S. Ikeda, O. Yoshida, J. Sasabe, Hua Su","doi":"10.1109/ASMC.2002.1001578","DOIUrl":null,"url":null,"abstract":"A method is described for reducing systematic defects in the initial stages of production and thereby improving yield. Statistical correlation analysis is used to find the critical process parameters that cause yield loss. Application of the proposed method to actual 300-mm wafer fabrication demonstrated that it does detect the parameters to be modified resulting in yield improvement.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"A statistical method for reducing systematic defects in the initial stages of production\",\"authors\":\"K. Nemoto, S. Ikeda, O. Yoshida, J. Sasabe, Hua Su\",\"doi\":\"10.1109/ASMC.2002.1001578\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A method is described for reducing systematic defects in the initial stages of production and thereby improving yield. Statistical correlation analysis is used to find the critical process parameters that cause yield loss. Application of the proposed method to actual 300-mm wafer fabrication demonstrated that it does detect the parameters to be modified resulting in yield improvement.\",\"PeriodicalId\":64779,\"journal\":{\"name\":\"半导体技术\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"半导体技术\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2002.1001578\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"半导体技术","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ASMC.2002.1001578","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A statistical method for reducing systematic defects in the initial stages of production
A method is described for reducing systematic defects in the initial stages of production and thereby improving yield. Statistical correlation analysis is used to find the critical process parameters that cause yield loss. Application of the proposed method to actual 300-mm wafer fabrication demonstrated that it does detect the parameters to be modified resulting in yield improvement.