经济型300/450毫米集成电路制造商的创新

B. Wu
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引用次数: 2

摘要

在自动化环境下,传统设计的300mm集成电路制造商存在许多缺点,例如:高资本支出和高拥有成本,晶圆厂建设时间长,多产品和多工艺操作灵活性低,工艺周期长,在制品量大。这些缺点对300mm晶圆厂的经济性有巨大的影响。本文提出了一种新的晶圆厂架构和操作理念,以提高300毫米/450毫米晶圆厂的经济性。新的晶圆厂架构和设计将减少50%的资本支出和晶圆厂建设时间,提高100%的设备利用率,降低30%的COO,减少至少30%的工艺周期时间和在制品,并减少30%的年度运营费用。集成电路制造商和设备供应商在整个设备和晶圆厂生命周期内的合作是这种新方法的组成部分。通过紧密合作,双方都将获得经济回报。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Innovations for economical 300/450 mm IC fabricators
The conventionally designed 300 mm IC fabricator in an automated environment has many drawbacks such as: high capital outlay and high cost of ownership, long fab construction time, low flexibility for multiproduct and multi-process operation, long process cycle time and high work in process. These drawbacks have an enormous impact on the economics of a 300 mm fab. This paper proposes a new fab architecture and operational philosophy to improve the economics of 300 mm/450 mm fabs. The new fab architecture and design will reduce capital outlay and fab construction time by 50%, increase equipment utilization by 100%, reduce COO by 30%, and reduce both process cycle time and work in process by at least 30%, and cut annual operating expense by 30%. Integral to this new approach is the cooperative alignment of IC makers and equipment suppliers throughout the equipment and fab life cycle. By closely working together, both will reap the economic rewards.
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