板级电子封装动态弯曲试验及数值模拟

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4606969

Q. Fei, Wang Yngve, Liu Bin, An Tong, J. Ling

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引用次数: 2

摘要

为了研究板级电子封装焊点的可靠性，对其进行了四点动态弯曲试验。采用高速摄像机和数字图像相关法测量PCB板的挠度。建立了模拟试验的有限元模型，并通过试验数据进行了验证。随后进行了参数研究。结果表明，当PCB板刚度达到一定值时，剥离应力达到峰值。封装安装角度对焊点的剥落应力有显著影响。

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Dynamic bending tests and numerical simulation of board level electronic package

4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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