用于NBTI和PBTI无恢复评估的32nm SRAM可靠性宏

P. Jain, A. Paul, Xiaofei Wang, C. Kim
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引用次数: 9

摘要

开发了一种可扩展的测试结构,用于评估NBTI和PBTI对SRAM宏中读写操作的影响。一种新颖的非侵入性方法将应力中断保持在几微秒内进行测量,防止不必要的BTI恢复,同时在32kb子阵列上提供并行应力测量能力。在32nm高κ/金属栅绝缘体上硅工艺的测量结果表明,所提出的方案在读取VMIN精度上提高了35mV,在BFR精度上提高了10倍。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 32nm SRAM reliability macro for recovery free evaluation of NBTI and PBTI
A scalable test structure for recovery free evaluation of the impact of NBTI and PBTI on read/write operation in a SRAM macro has been developed. A novel non-invasive methodology keeps the stress interrupts for measurements within a few microseconds, preventing unwanted BTI recovery, while providing a parallel stress-measure capability on 32kb sub-arrays. Measurement results in a 32nm high-κ/metal-gate silicon-on-insulator process show that proposed schemes provides 35mV better accuracy in read VMIN and 10X accuracy in BFR.
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