{"title":"叠置夹层上q波段贴片天线的设计、制造与特性研究","authors":"Yunheng Sun, Yufeng Jin, Tingting Lian, Shengli Ma, Yuchi Yang, Wei Wang, Liu-lin Hu, Shuwei He","doi":"10.1109/ECTC32862.2020.00347","DOIUrl":null,"url":null,"abstract":"In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a –10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"10 1","pages":"2230-2235"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers\",\"authors\":\"Yunheng Sun, Yufeng Jin, Tingting Lian, Shengli Ma, Yuchi Yang, Wei Wang, Liu-lin Hu, Shuwei He\",\"doi\":\"10.1109/ECTC32862.2020.00347\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a –10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.\",\"PeriodicalId\":6722,\"journal\":{\"name\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"10 1\",\"pages\":\"2230-2235\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32862.2020.00347\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32862.2020.00347","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design, fabrication and characterization of a Q-band patch antenna integrated on stacked interposers
In this study, we present a Q-band patch antenna with an underling cavity integrated on the stacked high-resistivity Si interposers. A process is developed and sample is fabricated. Evaluation is done and the measurement results shows that it has an operating frequency of 32.75GHz, a –10dB bandwidth of 1.04GHz, a maximum gain of 3dB. Those results prove the feasibility of integrating high-frequency antennas with TSV interposer preliminary.
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