通过冲击试验评估焊料凸点的抗冲击性能

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-08-22 DOI:10.1109/ICEPT.2008.4607126

H. Xi, Minyi Lou, B. An, Fengshun Wu, Yiping Wu

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引用次数: 0

摘要

采用高速冲击的方法研究了无铅Sn96.5-Ag3.0-Cu0.5焊点的抗冲击性能，探讨了其断裂方式与焊点回流分布及组织的关系。采用不同回流形状和多次回流形成钎料凸点，并在1.8 m/s的恒速度和50 ma的剪切距离下进行冲击试验。结果表明，内模控制状态与单次回流冲击行为密切相关。当加热系数增加到800s℃以上时，IMC层厚度增加，凸点冲击吸收能迅速增加。采用同一型线进行多次回流时，内嵌层厚度变化不大，但失效模式变化较大。

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Evaluate anti-shock property of solder bumps by impact test

Anti-shock property of lead-free Sn96.5-Ag3.0-Cu0.5 solder bumps was investigated by the high speed impact to explore the relation among the fracture modes and the reflow profile and the microstructure of solder joint. Solder bumps were formed with various reflow profiles and multi-reflow and then subjected to the impact test under a constant speed of 1.8 m/s and a shear standoff of 50 mum. The results show that the IMC status has a close relation with the impact behavior upon one reflow. When the heating factor increases beyond 800 s-degC, the thickness of IMC layer goes up, and the impact absorbed energy of solder bump raises quickly. Upon multi-reflow using the same profile, the IMC thickness changed a little but the failure modes varied a lot.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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