{"title":"《锡须》特刊简介","authors":"M. Osterman","doi":"10.1109/TEPM.2010.2063670","DOIUrl":null,"url":null,"abstract":"The seven papers in this special section focus on research related to tin whisker growth and mitigation.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"6 1","pages":"157-158"},"PeriodicalIF":0.0000,"publicationDate":"2010-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Introduction to the Special Issue on Tin Whiskers\",\"authors\":\"M. Osterman\",\"doi\":\"10.1109/TEPM.2010.2063670\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The seven papers in this special section focus on research related to tin whisker growth and mitigation.\",\"PeriodicalId\":55010,\"journal\":{\"name\":\"IEEE Transactions on Electronics Packaging Manufacturing\",\"volume\":\"6 1\",\"pages\":\"157-158\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electronics Packaging Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEPM.2010.2063670\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electronics Packaging Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEPM.2010.2063670","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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