{"title":"半半球形高q因子谐振器的刚性-柔性混合工艺制备","authors":"Vincens Gjokaj, P. Chahal","doi":"10.1109/ECTC32862.2020.00356","DOIUrl":null,"url":null,"abstract":"In this paper, a 3D printed high-Q semihemispherical resonator fed by a coax-like transmission line is demonstrated. The semi hemispherical resonator was fabricated using polyjet printing followed by blanket metalization. It is coupled to a two-part coax-like transmission line using a slot in the 3D printed structure. The coax-like structure is fabricated using a hybrid process, combining 3D printing and fine line patterning using microlithography. Unloaded Q-factor of >8000 is measured near 44 GHz. This work shows that a 3D printed high-Q resonator can readily be coupled with microfabricated circuits on a printed circuit board or a flex substrate. Details of design, fabrication, and measurements are presented, and the measured and simulation results match closely.","PeriodicalId":6722,"journal":{"name":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","volume":"126 1","pages":"2284-2288"},"PeriodicalIF":0.0000,"publicationDate":"2020-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A Semi-Hemispherical High Q-Factor Resonators Fabricated using a Hybrid Rigid-Flex Process\",\"authors\":\"Vincens Gjokaj, P. Chahal\",\"doi\":\"10.1109/ECTC32862.2020.00356\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a 3D printed high-Q semihemispherical resonator fed by a coax-like transmission line is demonstrated. The semi hemispherical resonator was fabricated using polyjet printing followed by blanket metalization. It is coupled to a two-part coax-like transmission line using a slot in the 3D printed structure. The coax-like structure is fabricated using a hybrid process, combining 3D printing and fine line patterning using microlithography. Unloaded Q-factor of >8000 is measured near 44 GHz. This work shows that a 3D printed high-Q resonator can readily be coupled with microfabricated circuits on a printed circuit board or a flex substrate. Details of design, fabrication, and measurements are presented, and the measured and simulation results match closely.\",\"PeriodicalId\":6722,\"journal\":{\"name\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"126 1\",\"pages\":\"2284-2288\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC32862.2020.00356\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 70th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC32862.2020.00356","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Semi-Hemispherical High Q-Factor Resonators Fabricated using a Hybrid Rigid-Flex Process
In this paper, a 3D printed high-Q semihemispherical resonator fed by a coax-like transmission line is demonstrated. The semi hemispherical resonator was fabricated using polyjet printing followed by blanket metalization. It is coupled to a two-part coax-like transmission line using a slot in the 3D printed structure. The coax-like structure is fabricated using a hybrid process, combining 3D printing and fine line patterning using microlithography. Unloaded Q-factor of >8000 is measured near 44 GHz. This work shows that a 3D printed high-Q resonator can readily be coupled with microfabricated circuits on a printed circuit board or a flex substrate. Details of design, fabrication, and measurements are presented, and the measured and simulation results match closely.