纳米Sn-Ag-Cu增强Sn-Bi无铅焊料的制备、显微组织和显微硬度分析

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607057

Lili Zhang, W. Tao, J. Liu, Yan Zhang, Z. Cheng, C. Andersson, Yulai Gao, Q. Zhai

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引用次数: 4

摘要

研究了在普通共晶Sn-58Bi焊锡膏中加入Sn-3.0Ag-0.5Cu (SAC)纳米颗粒制备的复合钎料。进行了显微组织分析和维氏显微硬度测定。利用自主研发的损耗电极直流电弧(CDCA)技术，制备了Sn-3.0Ag-0.5Cu纳米粒子，平均粒径在20 ~ 80 nm之间。将纳米SAC颗粒与共晶Sn-Bi锡膏充分混合，制备了增强无铅Sn-Bi焊料。将SAC增强Sn-Bi复合锡膏印刷在ENIG/Cu金属化衬底上，并在常规回流炉中回流。再流处理后，利用扫描电镜(SEM)和透射电镜(TEM)观察了复合钎料凝固后的形貌。维氏显微硬度测试表明，SAC纳米颗粒的加入提高了共晶焊料的整体强度，这与弥散强化理论相吻合。

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Manufacture, microstructure and microhardness analysis of Sn-Bi lead-free solder reinforced with Sn-Ag-Cu nano-particles

This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed consumable-electrode direct current arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between 20 and 80 nm are prepared. The reinforced lead-free Sn-Bi solder was prepared by thoroughly blending the nanometer-sized SAC particles into the eutectic Sn-Bi solder paste. The SAC reinforced Sn-Bi composite solder paste was printed onto ENIG/Cu metalized substrate and reflowed in a conventional reflow oven. After reflow, the morphology of the as-solidified reinforced composite solder was observed by means of SEM and TEM. The Vickers microhardness measurements indicated that the addition of SAC nano-particles enhances the overall strength of the eutectic solder, and the results agree well with the theory of dispersion strengthening.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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