M. Hoshiyama, M. Hasegawa, T. Sato, H. Yoshii, O. Suzuki, K. Kotaka, T. Nagasaka, A. Horibe, Marie-Claude Paquet, M. Gaynes, C. Feger, K. Sakuma, J. Knickerbocker, Y. Orii, K. Terada, K. Ishikawa, Y. Hirayama
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Vacuum underfill technology for advanced packaging (IMPACT 2011)
We developed vacuum underfill (VCUF) technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for future package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package with vacuum assisted underfill process.
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