在Si上使用AlGaN/GaN HEMT的异质外延生长和功率电子学

T. Egawa
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引用次数: 37

摘要

本文报道了硅衬底上AlGaN/GaN HEMT的异质外延生长和特性的进展。高温生长的AlGaN/AlN中间层和GaN/AlN应变层超晶格可以有效地提高后续GaN层的结晶度,并在Si上生长较厚的器件结构,从而获得高击穿电压。Si上的AlGaN/GaN HEMT的击穿电压高达1402 V,其质量因数(FOM = BV2/Ron)为2.6×108 V2Ω-1cm-2。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Heteroepitaxial growth and power electronics using AlGaN/GaN HEMT on Si
Developments of heteroepitaxial growth and characteristics of an AlGaN/GaN HEMT on a Si substrate are reported. High-temperature-grown AlGaN/AlN intermediate layers and GaN/AlN strained layer superlattice are effective in improving the crystallinity of a following GaN layer and for growing thick device structure on Si, which resulted in obtaining high-breakdown voltage. The AlGaN/GaN HEMT on Si exhibited the breakdown voltage as high as 1402 V with a state-of-the-art figure-of-merit (FOM = BV2/Ron) of 2.6×108 V2Ω-1cm-2.
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