采用MOCVD在Si衬底上生长30nm增强模式In0.53Ga0.47As mosfet,具有高跨导性和低导通电阻

Xiuju Zhou, Qiang Li, C. Tang, K. Lau
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引用次数: 18

摘要

本文描述了在Si衬底上生长的30nm增强模式In0.53Ga0.47As mosfet的开发,该mosfet采用Al2O3/InAlAs复合栅极堆叠,在Vds=0.5V时的外在跨导为1700mS/mm,导通电阻为157 Ω·μm。为了实现增强模式操作,开发了一种金属化后低温退火工艺。通过电容电压测量和透射电镜观察,探讨了阈值电压漂移的机理。此外,器件可扩展性低至30nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
30nm enhancement-mode In0.53Ga0.47As MOSFETs on Si substrates grown by MOCVD exhibiting high transconductance and low on-resistance
This paper describes the development of 30nm enhancement-mode In0.53Ga0.47As MOSFETs grown on Si substrates featuring Al2O3/InAlAs composite gate stack with extrinsic transconductance of 1700mS/mm at Vds=0.5V and on-resistance of 157 Ω·μm. A low-temperature process of post metallization annealing has been developed to achieve enhancement-mode operation. Capacitance-Voltage measurements and TEM observation were carried out to investigate the mechanisms of threshold voltage shift. Furthermore, device scalability down to 30nm is reported.
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