三维集成应用中Cu与苯并环丁烯(BCB)聚合物介电体的粘附研究

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117239

W. C. Huang, C. Ko, S. Hu, J. Leu, K. N. Chen

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引用次数: 4

摘要

本文研究了铜金属与苯并环丁烯(Benzocyclobutene, BCB)聚合物介电体的粘附强度。讨论了金属层厚度与粘结强度的关系以及铜与BCB聚合物层堆积顺序与粘结强度的关系。最后，对在Cu金属和BCB聚合物层之间增加一层以提高粘接强度的概念进行了评价。研究结果可为三维集成应用的杂化键合和下填提供重要的指导。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigations of adhesion between Cu and Benzocyclobutene (BCB) polymer dielectric for 3D integration applications

In this paper, the adhesion strength between Cu metal and Benzocyclobutene (BCB) polymer dielectric was investigated and reported. The relation between the adhesion strength and thickness of metal layer and the relation between the adhesion strength and stacking order of copper and BCB polymer layer are discussed as well. Finally, the concept of an extra layer between Cu metal and BCB polymer layer to improve the adhesion strength was evaluated. The results of this research can provide important guidelines of hybrid bonding and underfill for 3D integration applications.

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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