用于电信波段极光管理的混合钒酸硅纳米光子平台

Yusheng Bian, A. Jacob, Won Suk Lee, Bo Peng, M. Rakowski, A. Aboketaf, R. Augur
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引用次数: 0

摘要

我们提出了一种混合钒酸盐/硅光子学平台,该平台将钒酸盐纳米结构与绝缘体上硅(SOI)波导集成在一起,用于电信波长的高性能功能被动构建块。本文对钒酸盐衬底分离的硅脊混合波导结构中的模式杂化进行了全面的数值分析。对关键几何参数影响的研究表明,钒酸盐与光子结构之间的耦合导致了具有极端场约束的高约束杂化模式,与基于贵金属的杂化等离子激元(HPPs)波导系统相比,其有效指数明显更高。通过利用钒酸盐材料提供的独特约束和模态特性,我们探索了基于钒酸盐和SOI结构的适当组合构建超紧凑波导衰减器和横磁(TM)通极化器的可行性。我们的研究表明,对于横向电(TE)和TM极化,5μm长的衰减器可以同时实现超过30 dB的吸收和低于-27 dB的低光回波损耗。此外,通过适当管理不同极化的钒酸盐模式和硅模式之间的相互作用,我们在数值上展示了一种超紧凑(3 μm)片上tm通偏振器,具有低插入损耗(~ 3 dB)和超过22 dB的消光比。因此,钒酸盐材料与SOI平台的集成提供了弥补传统硅光子系统差距的潜力,并为电信频段可扩展功能集成硅光子器件开辟了新的途径。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hybrid vanadate silicon nanophotonic platform for extreme light management at telecom bands
We present a hybrid vanadate/silicon-photonics platform that integrates vanadate nanostructures with silicon-on-insulator (SOI) waveguides for high-performance functional passive building blocks at telecommunication wavelengths. Comprehensive numerical analysis is performed to study the mode hybridization in a hybrid waveguide structure that comprises a silicon ridge separated from a vanadate substrate. Studies on the impact of key geometric parameters reveal that the coupling between vanadate and photonic structures result in highly confined hybrid modes with extreme field confinement and significantly larger effective indices as compared to hybrid plasmon polarizations (HPPs) supported by noble-metal-based waveguiding systems. By leveraging the unique confinement and modal properties offered by vanadate material, we explore the feasibility of building ultra-compact waveguide attenuators and transverse-magnetic (TM)-pass polarizers based on proper combinations of vanadate and SOI configurations. Our studies indicate that a 5μm-long attenuator can simultaneously achieve over 30 dB absorption and a low optical return loss less than -27 dB for both transverse-electric (TE) and TM polarizations. In addition, through proper management of the interactions between vanadate and silicon modes with different polarizations, we numerically demonstrate an ultra-compact (3 μm) on-chip TM-pass polarizer featuring low insertion loss (~ 3 dB), in conjunction with an extinction ratio exceeding 22 dB. The integration of vanadate materials with SOI platforms thereby offers the potential to bridge a gap in conventional silicon photonic systems and opens new avenues towards scalable functional integrated silicon photonic devices at telecom bands.
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