金丝粘结破坏拉拔试验及其不对称分布的性能研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607119

Jin Peng

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引用次数: 0

摘要

在1号和2号两台高精密设备上研究了1金丝破坏性拉拔试验的统计过程控制(SPC)。结果发现，两个零件的Cpk都在1.2左右，没有达到我们的目标1.33和最终的6西格玛(Cpk= 2)。然而，本研究表明，如果考虑到公差不对称，传统的计算Cpk的方法低估了过程控制的能力，例如1密金丝键合的情况。

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Capability study on the destructive pull test of 1 mil gold wire bond and its asymmetric distribution

The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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