高可靠性的环保电子产品

J. McElroy, R. Pfahl
{"title":"高可靠性的环保电子产品","authors":"J. McElroy, R. Pfahl","doi":"10.1109/ICEPT.2008.4607068","DOIUrl":null,"url":null,"abstract":"In 2006 when the European Unionpsilas RoHS Regulation went into effect, a number of global firms who produce high-reliability products such as servers and telecommunication equipment had decided to take the exemption allowed for Pb containing solders in these applications. As a result they had not completed the tests necessary to prove the reliability of Tin Silver Copper (SAC) alloys in these applications. In 2007 it became apparent to many of these firms that they could no longer procure components with traditional SnPb surface finishes, and thus they faced an unknown reliability risk. In 2006 iNEMI had begun a study to evaluate the reliability of ldquoPb-Free BGAs in SnPb Assemblies.rdquo This paper will report on the results of this initial study and will then report on several studies currently under way to evaluate the reliability of new green-materials in high-reliability applications.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"66 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Environmentally friendly electronics for high reliability\",\"authors\":\"J. McElroy, R. Pfahl\",\"doi\":\"10.1109/ICEPT.2008.4607068\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In 2006 when the European Unionpsilas RoHS Regulation went into effect, a number of global firms who produce high-reliability products such as servers and telecommunication equipment had decided to take the exemption allowed for Pb containing solders in these applications. As a result they had not completed the tests necessary to prove the reliability of Tin Silver Copper (SAC) alloys in these applications. In 2007 it became apparent to many of these firms that they could no longer procure components with traditional SnPb surface finishes, and thus they faced an unknown reliability risk. In 2006 iNEMI had begun a study to evaluate the reliability of ldquoPb-Free BGAs in SnPb Assemblies.rdquo This paper will report on the results of this initial study and will then report on several studies currently under way to evaluate the reliability of new green-materials in high-reliability applications.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"66 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607068\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

2006年,当欧盟的RoHS法规生效时,许多生产高可靠性产品(如服务器和电信设备)的全球公司决定在这些应用中采用含铅焊料允许的豁免。因此,他们没有完成必要的测试,以证明锡银铜(SAC)合金在这些应用中的可靠性。2007年,很多公司发现他们无法再采购具有传统SnPb表面处理的部件,因此他们面临着未知的可靠性风险。2006年,iNEMI开始了一项研究,以评估SnPb组件中不含ldquopb的BGAs的可靠性。本文将报告这一初步研究的结果,然后将报告目前正在进行的几项研究,以评估新型绿色材料在高可靠性应用中的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Environmentally friendly electronics for high reliability
In 2006 when the European Unionpsilas RoHS Regulation went into effect, a number of global firms who produce high-reliability products such as servers and telecommunication equipment had decided to take the exemption allowed for Pb containing solders in these applications. As a result they had not completed the tests necessary to prove the reliability of Tin Silver Copper (SAC) alloys in these applications. In 2007 it became apparent to many of these firms that they could no longer procure components with traditional SnPb surface finishes, and thus they faced an unknown reliability risk. In 2006 iNEMI had begun a study to evaluate the reliability of ldquoPb-Free BGAs in SnPb Assemblies.rdquo This paper will report on the results of this initial study and will then report on several studies currently under way to evaluate the reliability of new green-materials in high-reliability applications.
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