A. Dasgupta, A. Alam, Guangqi Ouyang, SivaChandra Jangam, S. Iyer
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In this paper we demonstrate a 20 GHz patch antenna on the Silicon-Interconnect Fabric (Si-IF) platform. Two methodologies to integrate the antenna are explored in this paper. One is to embed a Fused Silica die inside a recess etched on the Si-IF. The second method is to compression mold Polydimethylsiloxane (PDMS) into the Si-IF recess. The antennas fabricated with both the methods are compatible with Ground- Signal-Ground (GSG) probing, and interfacing with off the shelf MMIC dies. Along with the process flow, we also present experimental characterisation of the fabricated antennas.
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