包装材料的水分扩散模型验证

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607066

Xiaosong Ma, K. Jansen, L. Ernst, W. V. van Driel, O. van der Sluis, G.Q. Zhang, C. Regard, C. Gautier, H. Frémont

{"title":"包装材料的水分扩散模型验证","authors":"Xiaosong Ma, K. Jansen, L. Ernst, W. V. van Driel, O. van der Sluis, G.Q. Zhang, C. Regard, C. Gautier, H. Frémont","doi":"10.1109/ICEPT.2008.4607066","DOIUrl":null,"url":null,"abstract":"The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"9 5 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Moisture diffusion model verification of packaging materials\",\"authors\":\"Xiaosong Ma, K. Jansen, L. Ernst, W. V. van Driel, O. van der Sluis, G.Q. Zhang, C. Regard, C. Gautier, H. Frémont\",\"doi\":\"10.1109/ICEPT.2008.4607066\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"9 5 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607066\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607066","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 11

摘要

在电子封装中使用非密封材料确实引起了一个潜在的问题，即回流过程中水分引起的界面分层和爆裂。因此，正确建立吸湿性能模型是非常重要的。研究了三种包装材料的吸湿解吸性能。对不同温度和湿度下吸湿平衡、增重和扩散系数进行了表征。根据湿度敏感性测试水平，使用3D模型模拟吸湿过程。最后通过研究载体的吸湿性验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Moisture diffusion model verification of packaging materials

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 International Conference on Electronic Packaging Technology & High Density Packaging

自引率

0.00%

发文量