{"title":"环境对锡晶须生长的影响","authors":"A. Dimitrovska, R. Kovacevic","doi":"10.1109/TEPM.2010.2048034","DOIUrl":null,"url":null,"abstract":"This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation at the film/substrate interface by X-ray Diffraction (XRD), and film thickness.","PeriodicalId":55010,"journal":{"name":"IEEE Transactions on Electronics Packaging Manufacturing","volume":"16 1","pages":"193-197"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Environmental Influence on Sn Whisker Growth\",\"authors\":\"A. Dimitrovska, R. Kovacevic\",\"doi\":\"10.1109/TEPM.2010.2048034\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation at the film/substrate interface by X-ray Diffraction (XRD), and film thickness.\",\"PeriodicalId\":55010,\"journal\":{\"name\":\"IEEE Transactions on Electronics Packaging Manufacturing\",\"volume\":\"16 1\",\"pages\":\"193-197\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-06-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electronics Packaging Manufacturing\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEPM.2010.2048034\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electronics Packaging Manufacturing","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEPM.2010.2048034","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper considers the influence of 1) humidity and 2) acidic humidity on the growth of Sn whiskers. Sn whisker morphology was observed over a six-month period. The results show that the electroplated surfaces exposed to pure humidity are populated with Sn whiskers dimensionally smaller than surfaces exposed to acidic humidity. Variables analyzed include surface condition, Cu-Sn inter-metallic formation at the film/substrate interface by X-ray Diffraction (XRD), and film thickness.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
