Ni纳米颗粒对Sn-Ag无铅焊料剪切性能和显微组织的影响

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607054

Fangjuan Qi, Li Sun, Zhezhe Hou, Jianqiang Wang, C. Qin

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引用次数: 2

摘要

研究了Ni纳米粒子的加入对Sn-3.5Ag无铅焊点剪切性能和显微组织的影响。通过在干燥的纳米粒子中加入分散剂，并将Ni纳米粒子机械搅拌到Sn-3.5Ag无铅锡膏中，制备了镍纳米复合Sn-3.5Ag钎料。测试了Sn-3.5Ag、0.5 wt%和1.0 wt%镍纳米复合钎料在回流120秒和240秒时的剪切力。结果表明:纳米镍的加入可以改善焊接接头的剪切性能;在回流240s时，加入0.5 wt% Ni纳米颗粒的焊接接头剪切力最大。SEM观察表明，在钎料中加入Ni纳米粒子后，钎料内部的六角形Cu6Sn5金属间化合物IMC逐渐消失，钎料界面上的IMC形态变为平面形态。

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The effects of Ni nanoparticles addition on shear behavior and microstructure of Sn-Ag Lead-free solder

In this article, the effects of Ni nanoparticles addition on shear property and microstructure of Sn-3.5Ag Lead-free solder joint was studied. The nickel nano-composite Sn-3.5Ag solder was prepared by adding dispersant to the dry nanoparticles and mechanically stirred Ni nanoparticles into the Sn-3.5Ag Lead-free solder paste. The shear force of the Sn-3.5Ag solder, 0.5 and 1.0 wt% nickel nano-composite solder was tested respectively at reflow 120s and 240s. The result shows that adding nickel nanoparticles can improve the shear performance of the soldered joint; the shear force of the soldered joint is highest when adding 0.5 wt% Ni nanoparticles at reflow 240s. The SEM observations shows that the hexagonal Cu6Sn5 IMC (intermetallic compound) in the inside solder is disappears gradually and the morphsa of the IMC that on the interface of the solder joint becomes planar after adding Ni nanoparticles into solder.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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