{"title":"TiZrV-, Pd-或Pd/TiZrV-涂层铜管热解吸和泵送性能的比较研究","authors":"X. Jin, T. Uchiyama, Y. Tanimoto, T. Honda","doi":"10.1116/6.0001475","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":17495,"journal":{"name":"Journal of Vacuum Science & Technology B","volume":"25 1","pages":""},"PeriodicalIF":1.4000,"publicationDate":"2021-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Comparative study of thermal desorption and pumping performance for TiZrV-, Pd-, or Pd/TiZrV-coated copper tubes\",\"authors\":\"X. Jin, T. Uchiyama, Y. Tanimoto, T. Honda\",\"doi\":\"10.1116/6.0001475\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\",\"PeriodicalId\":17495,\"journal\":{\"name\":\"Journal of Vacuum Science & Technology B\",\"volume\":\"25 1\",\"pages\":\"\"},\"PeriodicalIF\":1.4000,\"publicationDate\":\"2021-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Vacuum Science & Technology B\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1116/6.0001475\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Vacuum Science & Technology B","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1116/6.0001475","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
期刊介绍:
Journal of Vacuum Science & Technology B emphasizes processing, measurement and phenomena associated with micrometer and nanometer structures and devices. Processing may include vacuum processing, plasma processing and microlithography among others, while measurement refers to a wide range of materials and device characterization methods for understanding the physics and chemistry of submicron and nanometer structures and devices.