小型化Sn-Ag-Cu焊点β-Sn晶粒数限制

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607056

Shihua Yang, Chunqing Wang, Yanhong Tian, P. Lin, Le Liang

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引用次数: 1

摘要

不同直径的回流Sn-Ag-Cu焊点只含有几个β - sn晶粒。随着焊点的日益小型化，焊点的晶粒数没有明显变化。时效的Sn-Ag-Cu焊点也由数量非常有限的β - sn晶粒组成。焊点尺寸和热时效对β - sn晶粒生长的影响较小。

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Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints

As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less influence on the growth of beta-Sn grains.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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