{"title":"半导体器件制造的超临界流体工艺","authors":"L. Rothman, R. J. Robey, M. K. Ali, D. Mount","doi":"10.1109/ASMC.2002.1001636","DOIUrl":null,"url":null,"abstract":"As semiconductor device dimensions approach the nanoscale, it will become increasing difficult to use aqueous-based cleaning processes due to high surface tension and capillary forces. Supercritical fluids provide the enabling capabilities for overcoming these process barriers. This paper will discuss the use of supercritical carbon dioxide and co-solvents for photoresist stripping and wafer cleaning.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Supercritical fluid processes for semiconductor device fabrication\",\"authors\":\"L. Rothman, R. J. Robey, M. K. Ali, D. Mount\",\"doi\":\"10.1109/ASMC.2002.1001636\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As semiconductor device dimensions approach the nanoscale, it will become increasing difficult to use aqueous-based cleaning processes due to high surface tension and capillary forces. Supercritical fluids provide the enabling capabilities for overcoming these process barriers. This paper will discuss the use of supercritical carbon dioxide and co-solvents for photoresist stripping and wafer cleaning.\",\"PeriodicalId\":64779,\"journal\":{\"name\":\"半导体技术\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"半导体技术\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2002.1001636\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"半导体技术","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ASMC.2002.1001636","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Supercritical fluid processes for semiconductor device fabrication
As semiconductor device dimensions approach the nanoscale, it will become increasing difficult to use aqueous-based cleaning processes due to high surface tension and capillary forces. Supercritical fluids provide the enabling capabilities for overcoming these process barriers. This paper will discuss the use of supercritical carbon dioxide and co-solvents for photoresist stripping and wafer cleaning.
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