薄膜力学性能测试芯片的设计

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607079

Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao, G. Ding

{"title":"薄膜力学性能测试芯片的设计","authors":"Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao, G. Ding","doi":"10.1109/ICEPT.2008.4607079","DOIUrl":null,"url":null,"abstract":"Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"33 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Design of testing chip for measuring mechanical properties of thin films\",\"authors\":\"Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao, G. Ding\",\"doi\":\"10.1109/ICEPT.2008.4607079\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"33 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607079\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607079","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

单轴拉伸试验是测量薄膜力学性能最可靠的方法。单轴拉伸试验的难点在于如何制作小而无应力的试样、试样对准和脱扣、产生小的力和测量应变。提出了一种用于测量大伸长率薄膜试样的新型拉伸测试芯片，并采用UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung)技术制作了该芯片。这种新型测试芯片具有良好的对准性，能够承受较大的变形。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Design of testing chip for measuring mechanical properties of thin films

Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 International Conference on Electronic Packaging Technology & High Density Packaging

自引率

0.00%

发文量