新型平面电容(PCAP)车辆的演示，以评估电介质和金属阻隔薄膜

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI:10.1109/IITC-MAM.2015.7325646

Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo

{"title":"新型平面电容(PCAP)车辆的演示，以评估电介质和金属阻隔薄膜","authors":"Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo","doi":"10.1109/IITC-MAM.2015.7325646","DOIUrl":null,"url":null,"abstract":"Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.","PeriodicalId":6514,"journal":{"name":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","volume":"80 1","pages":"139-142"},"PeriodicalIF":0.0000,"publicationDate":"2015-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films\",\"authors\":\"Kevin L. Lin, J. Bielefeld, J. Chawla, C. Carver, R. Chebiam, J. Clarke, Jacob Faber, M. Harmes, T. Indukuri, C. Jezewski, R. Kasim, M. Kobrinsky, N. Kabir, B. Krist, Narendra V. Lakamraju, H. Lang, E. Mays, A. Myers, J. Plombon, K. Singh, J. Torres, H. Yoo\",\"doi\":\"10.1109/IITC-MAM.2015.7325646\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.\",\"PeriodicalId\":6514,\"journal\":{\"name\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"volume\":\"80 1\",\"pages\":\"139-142\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-05-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC-MAM.2015.7325646\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC-MAM.2015.7325646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

平面电容器可以快速测试金属和电介质的材料性能。一种侧壁电容器装置用于评价金属薄膜屏障。蚀刻停止平面电容器反过来可以测试多层蚀刻停止，暴露泄漏和良好的蚀刻停止膜之间的差异。还制备了可填充的平面电容器，并给出了该类填充材料的结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Demonstration of new planar capacitor (PCAP) vehicles to evaluate dielectrics and metal barrier thin films

Planar capacitors can quickly test material properties of metals and dielectrics for interconnects. A sidewall capacitor device is used to evaluate metal thin-film barriers. Etch stop planar capacitors in turn can test multi-layer etch stops, exposing differences between leaky and good etch stop films. Fillable planar capacitors are also fabricated and results presented for that class of fill materials.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

自引率

0.00%

发文量