{"title":"基于杀伤比的产量冲击计算的准确性","authors":"M. Ono, H. Iwata, K. Watanabe","doi":"10.1109/ASMC.2002.1001580","DOIUrl":null,"url":null,"abstract":"We evaluated the accuracy of yield impact calculations based on kill ratio analysis. The accuracy was calculated using computer simulated defect maps and bin maps. The results show that the yield impact was inaccurate when parametric faults caused low yield or a large number of non-killer defects were included in inspection reports. It is therefore recommended to evaluate bin maps and reduce the non-killer defects before calculating the yield impact.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Accuracy of yield impact calculation based on kill ratio\",\"authors\":\"M. Ono, H. Iwata, K. Watanabe\",\"doi\":\"10.1109/ASMC.2002.1001580\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We evaluated the accuracy of yield impact calculations based on kill ratio analysis. The accuracy was calculated using computer simulated defect maps and bin maps. The results show that the yield impact was inaccurate when parametric faults caused low yield or a large number of non-killer defects were included in inspection reports. It is therefore recommended to evaluate bin maps and reduce the non-killer defects before calculating the yield impact.\",\"PeriodicalId\":64779,\"journal\":{\"name\":\"半导体技术\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"半导体技术\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2002.1001580\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"半导体技术","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ASMC.2002.1001580","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Accuracy of yield impact calculation based on kill ratio
We evaluated the accuracy of yield impact calculations based on kill ratio analysis. The accuracy was calculated using computer simulated defect maps and bin maps. The results show that the yield impact was inaccurate when parametric faults caused low yield or a large number of non-killer defects were included in inspection reports. It is therefore recommended to evaluate bin maps and reduce the non-killer defects before calculating the yield impact.