基于白光阴影成像技术的各种基材翘曲测量

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117161

Shao Song, F. Zhu, Wei Zhang, Sheng Liu

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引用次数: 6

摘要

本文采用非接触式阴影测量技术测量了各种基材的翘曲量。同时，将移相技术应用于阴影成像所获得的基片条纹图像的分析。条纹图分析的灵敏度得到了显著提高。该系统测量了QFN (Quad Flat No-lead Package)金属基板和BGA (Ball Grid Array)基板两种样品。本文将表明，所提出的系统是一个强大的工具，测量各种基底翘曲。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Warpage measurement of various substrates based on white light shadow moiré technology

In this paper, warpage of various substrates are measured with a noncontact shadow moiré technology. Meanwhile, phase-shifting technology is applied to the analysis of fringe pattern images of substrates obtained by shadow moiré. Sensitivity of the fringe pattern analysis is demonstrated to be significantly increased. Two types of samples, QFN (Quad Flat No-lead Package) metal substrates, BGA (Ball Grid Array) substrates are measured by the system. This paper will show that the presented system is a powerful tool for measuring the warpage of various substrates.

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来源期刊

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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