An investigation of temperature influence on the SAC305 soldering on Cu-Ni-Au substrate

In the present paper, the intermetallic compound (IMC) thickness as a function of annealing temperature has been carefully investigated. It is observed that the IMC ingredients along the Sn3.5Ag0.5Cu (SAC305) solder on the Cu-Ni-Ag substrate are (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 after IR-reflow process. Based on the measurement of IMC thickness and ball shear force, the following conclusions have been discovered, (1) the composition of IMC unchanged if the annealing temperature below 400°C, (2) interface controlled reaction depends on the annealing temperature and demonstrates the IMC thickness decreases as the heat-up rate increased, (3) Preliminary results demonstrated that the measured ball shear force slightly changed for all different IMC thicknesses ((Ni, Cu)3Sn4 and (Cu, Ni)6Sn5).