三维集成TSV液冷的实验表征

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI:10.1109/IITC-MAM.2015.7325660

Manseok Park, Sungdong Kim, S. Kim

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引用次数: 3

摘要

3D集成的发展导致主要技术范式转移到所有IC器件，互连和封装。尽管具有3D集成的优势，但它面临着热管理的关键挑战，特别是对于高功率和高密度设备。由于传统热溶液的局限性，液体冷却方法引起了人们的极大兴趣。本研究设计并制作了具有不同tsv和微通道的直接液冷模块。对液冷模块的压降和温差进行了实验研究。

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Experimental characterization of TSV liquid cooling for 3D integration

The development of 3D integration causes the major technology paradigm shift to all of IC devices, interconnects, and packages. Despite the benefits of 3D integration, it faces a key challenge of thermal management, especially for high power and high density devices. Due to the limitation of conventional thermal solutions, a liquid cooling method is of great interest. In this study the direct liquid cooling module with different TSVs and microchannel has been designed and fabricated. Pressure drop and temperature differential of liquid cooling module were investigated experimentally.

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来源期刊

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

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