{"title":"集成射频电源应用中65nm CMOS的性能和限制","authors":"J. Scholvin, D. Greenberg, J. D. del Alamo","doi":"10.1109/IEDM.2005.1609353","DOIUrl":null,"url":null,"abstract":"In this study, we present the first measurements of the RF power performance of 65 nm CMOS for different voltages and layouts. We demonstrate that the 65 nm technology node is capable of achieving PAE values greater than 50% at 8 GHz, with Pout scalable to about 17 dBm. This is of interest for many applications. Greater performance is expected by optimizing the layout to minimize interconnect resistance","PeriodicalId":13071,"journal":{"name":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","volume":"224 1","pages":"369-372"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"15","resultStr":"{\"title\":\"Performance and limitations of 65 nm CMOS for integrated RF power applications\",\"authors\":\"J. Scholvin, D. Greenberg, J. D. del Alamo\",\"doi\":\"10.1109/IEDM.2005.1609353\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, we present the first measurements of the RF power performance of 65 nm CMOS for different voltages and layouts. We demonstrate that the 65 nm technology node is capable of achieving PAE values greater than 50% at 8 GHz, with Pout scalable to about 17 dBm. This is of interest for many applications. Greater performance is expected by optimizing the layout to minimize interconnect resistance\",\"PeriodicalId\":13071,\"journal\":{\"name\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"volume\":\"224 1\",\"pages\":\"369-372\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"15\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2005.1609353\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2005.1609353","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Performance and limitations of 65 nm CMOS for integrated RF power applications
In this study, we present the first measurements of the RF power performance of 65 nm CMOS for different voltages and layouts. We demonstrate that the 65 nm technology node is capable of achieving PAE values greater than 50% at 8 GHz, with Pout scalable to about 17 dBm. This is of interest for many applications. Greater performance is expected by optimizing the layout to minimize interconnect resistance
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