用于电力设备上超声波重铜线连接的铝盖铜焊垫

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Pub Date : 2015-05-18 DOI:10.1109/IITC-MAM.2015.7325658

David Gross, Sabine Haag, M. Reinold, M. Schneider-Ramelow, K. Lang

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引用次数: 2

摘要

厚的电镀铜键垫最近被证明可以实现重铜线键合，但铜氧化物需要在模接后进行额外的清洁步骤。为了避免这种清洗，测试了薄铝层在铜键焊盘上的钝化能力及其对键合过程的适用性。结果表明，复合材料的抗氧化性能和粘接性能均有显著提高。

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Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices

Thick electroplated Cu bond pads have lately been demonstrated to enable heavy Cu wire-bonding but the Cu oxides necessitate an additional cleaning step after the die-attach. To avoid such cleaning, the use of a thin Al layer is tested for its passivating ability on Cu bond pads and its suitability for the bonding process. Results show a significant improvement of the oxidation resistance and bonding performance.

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来源期刊

2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM)

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