焊料疲劳-蠕变相互作用损伤模型研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607157

Na Liu, Xiaoyan Li, Yongchang Yan

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引用次数: 0

摘要

众所周知，可靠性和可加工性是芯片尺寸封装(CSP)领域中更为重要的问题。蠕变载荷和疲劳载荷是焊点的主要载荷，焊点的可靠性应综合考虑这两种载荷。基于连续损伤力学理论，研究了疲劳与蠕变相互作用下的损伤演化过程。提出了一种新的疲劳-蠕变相互作用损伤模型。本文提出的疲劳-蠕变相互作用损伤模型不需要简单疲劳模型和简单蠕变模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Investigation on fatigue-creep interaction damage model for solder

It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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