高度集成的65纳米SoC工艺,增强了数字和模拟电路的功率/性能

L. Clark, D. Zhao, T. Bakhishev, H. Ahn, E. Boling, M. Duane, K. Fujita, P. Gregory, T. Hoffmann, M. Hori, D. Kanai, D. Kidd, S. Lee, Y. Liu, J. Mitani, J. Nagayama, S. Pradhan, P. Ranade, R. Rogenmoser, L. Scudder, L. Shifren, Y. Torii, M. Wojko, Y. Asada, T. Ema, S. Thompson
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引用次数: 21

摘要

采用无光晕、未掺杂外延沟道制备了65nm深度耗尽沟道(DDCTM)晶体管,实现了降低阈值电压(VT)变化、降低电源电压(VCC)、增强体效应和IEFF的功能。使用该技术制造的数字电路显示出从降低47%的功率到增加38%的频率的好处。尽管VDD较低,但模拟电路的放大器增益提高了4倍,NMOS和PMOS的电流镜像失配(全局和局部)分别降低了40%和30%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A highly integrated 65-nm SoC process with enhanced power/performance of digital and analog circuits
65nm Deeply Depleted Channel (DDCTM) transistors have been fabricated with a halo-free, un-doped epitaxial channel and enable reduced threshold voltage (VT) variation, lower supply voltage (VCC), enhanced body effect and IEFF. Digital circuits made using this technology show benefits ranging from 47% power reduction to 38% frequency increase. Analog circuits exhibit 4x greater amplifier gain despite lower VDD, and current mirror mismatch (both global and local) shows 40% and 30% reduction for NMOS and PMOS, respectively.
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